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CP 200/300 Semi-Automatic Probe Station


Multi-magnification Optical Display System

Compatible with 12”, 8”, 6”, and 4” wafer testing and dicing tests

Internal air suspension system effectively isolates external vibrations.

Integrated control system for rapid access to instrument testing

Software automation testing, precise calibration of mechanical accuracy

X-Y axis travel speed: 70 mm/sec, repeat positioning accuracy: ≤±1 μm

Z-axis travel speed: 20 mm/sec, Z-axis positioning repeatability: ≤ ±μm

R-axis accuracy: 0.0001°, repeat positioning accuracy: ≤±1 μm

Category:

CP Series Semi-Automatic Probe Station

  • Description
  • Parameters
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  • Summarize

    ●The CP300 Series Probe Stations for semi-automated testing of 300mm (12-inch) wafers are designed for R&D, device characterization/modeling, or niche production applications, and provide accurate electrical measurements over temperature ranges for ultra-low-noise, DC, RF, millimeter-wave, and terahertz applications, with automated operation for the fastest possible time to accurate data.

    ●The CP300 Semi-Automatic Probe Station provides laboratory automation capabilities and characterization of precision electrical measurement devices for high volume engineering and challenging applications. It is also well suited in customized solutions, production applications, and emerging markets.

    ●The CP300 Semi-Automatic Probe Station provides measurement accuracy and reliability in a fully modular solution for both I-V/C-V, RTN and RF measurements in a semi-automated system that can handle any combination of 200 mm and 300 mm wafers.

     

    Features and Advantage

     

    Designed for applications on a variety of chips

    DC-IV / DC-CV / Pulsed IV Applications Silicon Optical Devices

    RF, millimeter, negative pull applications and 4-port setups

    IC Design Verification, Failure Analysis over a Wide Temperature Range of -60-300°C

    Subarber wafer-level reliability

     

    Compatible with extended upgrades

    Can be used with both micropositioners and customized probe cards and is compatible at negative temperatures

    Programmable microscope motion for more automation and easy to use shortest cable interface to IC tester

    Minimize the distance from the platen to the chuck for millimeter wave and probing with active probes

    Supports 24/7 on-chip detection 7*24

     

    Ergonomic

    Easy front loading of integrated passive isolators on wafers or single DUTs

    More efficient and stable film delivery for easier system and test operations

    Rational space arrangement with reduced footprint

    Dashboard facilitates shorter cables and higher measurement accuracy

  • Chuck platform parameter specifications

    Chuck X-Y axis 

    Travel range

    ≥360 x 420mm

    resolution (of a photo)

    0.1 µm

    position accuracy

    ≤±2.0µm 

    Repeatability

    ≤±1.0 µm

    X-Y Stage Drive

    Closed-loop high-precision stepper motor

    Maximum movement speed

    ≥70mm/s

          

    Chuck axis 

    Travel range

    ≥20mm

    resolution (of a photo)

    0.1µm

    position accuracy

    ≤±2.0 µm

    Repeatability

    ≤±1.0 µm

    Z Stage drive

    Closed-loop high-precision stepper motor

    Maximum movement speed

    ≥20mm/s

    *Velocity is instantaneous, not average. There are acceleration and deceleration times when moving.

    Chuck Swivel

    Travel range

    ≥15°

    Resolution 

    0.0001°

    position accuracy

    ≤±2.0µm (measured at the edge of a 300 mm chuck)

    Repeatability

    ≤±1.0µm 

    Theta-class driver

    Closed-loop high-precision stepper motor

     

    Chucks

    Sizes

    ≥300mm (200mm chuck optional)

    Temp.

    -60-300°C (-60-300°C, room temperature, room temperature -200/300°C optional)

    Type

    Coaxial/Triaxial/High Power

    Wafer Fixing Method

    vacuum 

    Adsorption range

    0, 48, 96, 192 mm/ Porous adsorption (for thin films)

    Wiring Method

    BNC/Triaxial Kelvin Wiring

    flatness

    ≤10um@25℃ (after compensation)

     

     

    Performances

    Coaxial Chucks         Triaxial Chucks

    High Power Chuck (3KV)

    Breakdown voltage

     

    Shield - Signal                                ≥500V

    ≥3KV

    Shield-Guard                                 ≥500V

    ≥3KV

    Signal-Guard            ≥500V                 ≥500V

    ≥3KV

    numerical value of electrical impedance

     

    Shield-Signal                /                       ≥5TΩ  

                /  

    Shield-Guard               /                        ≥1TΩ   

                /

    Signal-Guard               ≥1TΩ                    ≥1TΩ   

                /

     

    Leakage

     

    Coaxial Chucks        Triaxial Chucks             High Power Chucks (3KV)

     ordinary temperatures

    ≤50PA                ≤50FA                   ≤2nA@coaxial@3KV

                                               ≤10PA@Triple Coaxial@3KV

    -60℃/-50℃/-40℃

    ≤100PA              ≤ 100FA                  ≤2nA@coaxial@3KV

                                               ≤10PA@Triple Coaxial@3KV

    200°C

    ≤100PA              ≤ 100FA                  ≤2nA@coaxial@3KV

                                               ≤10PA@Triple Coaxial@3KV

    300°C

    ≤100PA              ≤ 100FA                 ≤ 5nA@Coax @ 3KV

                                               ≤20PA@Triple Coaxial@3KV

    Auxiliary chuck

    Sizes

    55*55mm

    Quantities

    2

    Appliance

    RF calibration/debris or small size devices

    Adsorption method

    vacuum 

    Makings

    Ceramic/Steel/Teflon

     

     

    Temperature rise and fall time (12")

    Warming time

    -60℃ -25°C

    ≤10min

    25℃-200℃

    ≤25min

    200°C-300°C

    ≤25min

    cooling time

     

    25°C- -60°C

    ≤50min

    200°C-25°C

    ≤20min

    300-25°C

    ≤25min