Summarize
●The CP300 Series Probe Stations for semi-automated testing of 300mm (12-inch) wafers are designed for R&D, device characterization/modeling, or niche production applications, and provide accurate electrical measurements over temperature ranges for ultra-low-noise, DC, RF, millimeter-wave, and terahertz applications, with automated operation for the fastest possible time to accurate data.
●The CP300 Semi-Automatic Probe Station provides laboratory automation capabilities and characterization of precision electrical measurement devices for high volume engineering and challenging applications. It is also well suited in customized solutions, production applications, and emerging markets.
●The CP300 Semi-Automatic Probe Station provides measurement accuracy and reliability in a fully modular solution for both I-V/C-V, RTN and RF measurements in a semi-automated system that can handle any combination of 200 mm and 300 mm wafers.

Features and Advantage

Designed for applications on a variety of chips
DC-IV / DC-CV / Pulsed IV Applications Silicon Optical Devices
RF, millimeter, negative pull applications and 4-port setups
IC Design Verification, Failure Analysis over a Wide Temperature Range of -60-300°C
Subarber wafer-level reliability

Compatible with extended upgrades
Can be used with both micropositioners and customized probe cards and is compatible at negative temperatures
Programmable microscope motion for more automation and easy to use shortest cable interface to IC tester
Minimize the distance from the platen to the chuck for millimeter wave and probing with active probes
Supports 24/7 on-chip detection 7*24

Ergonomic
Easy front loading of integrated passive isolators on wafers or single DUTs
More efficient and stable film delivery for easier system and test operations
Rational space arrangement with reduced footprint
Dashboard facilitates shorter cables and higher measurement accuracy

Chuck platform parameter specifications

Chuck X-Y axis

Travel range	≥360 x 420mm
resolution (of a photo)	0.1 µm
position accuracy	≤±2.0µm
Repeatability	≤±1.0 µm
X-Y Stage Drive	Closed-loop high-precision stepper motor
Maximum movement speed	≥70mm/s

Chuck Z axis

Travel range	≥20mm
resolution (of a photo)	0.1µm
position accuracy	≤±2.0 µm
Repeatability	≤±1.0 µm
Z Stage drive	Closed-loop high-precision stepper motor
Maximum movement speed	≥20mm/s

*Velocity is instantaneous, not average. There are acceleration and deceleration times when moving.

Chuck Swivel

Travel range	≥15°
Resolution	0.0001°
position accuracy	≤±2.0µm (measured at the edge of a 300 mm chuck)
Repeatability	≤±1.0µm
Theta-class driver	Closed-loop high-precision stepper motor

Microscope platform parameter specifications

Microscope X-Y axis

X-Y travel range	50x50mm
resolution (of a photo)	1µm
position accuracy	≤±5.0µm
Repeatability	≤±2.0µm

Microscope Z-axis

Z travel range	120mm
resolution (of a photo)	0.1µm
position accuracy	≤±2.0µm
Repeatability	≤±1.0µm

Probe platform tops

Makings	Nickel-plated steel
Countertop Size	880*940mm
Probe Holder Mounting Positioning	Magnetic/Vacuum Holders
Multi-probe holder layout	12 DC probe holders or 4 DC + 4 RF probe holders layout
High and low temperature thermal expansion treatment	Insulation system and airflow convection method

Cavity Shielding Performance

Shielding type	Total darkness around the chuck.
Shielding method	Faraday cage
EMI shielding	≥ 30 dB 0.5-20 GHz
spectral noise floor	≤ -180 dBVrms/rtHz (≤ 1 MHz)
system AC noise	≤ 5 mVp-p (≤ 1 GHz)
optical attenuation	≥130dB

Microscope systems

Continuous zoom range	0.58X-7.5X continuous zoom
CCD	5 megapixel resolution 1920*1200 frame rate 40fps
Objective (optics)	1X, 2X, 5X, 10X
Magnification	140X-1818X (5X objective)

XY Handwheel

Handwheel Resolution	1000 lw/ph
Function	Easy adjustment of the lower needle position

Wafer Loading

Loading method	Manual loading
Pull-out range	≥80%
Pull-out box locking method	Cylinder locking
Top PIN	selectable
Door locks	Cannot be opened during exercise

Chucks

Sizes	≥300mm (200mm chuck optional)
Temp.	-60-300°C (-60-300°C, room temperature, room temperature -200/300°C optional)
Type	Coaxial/Triaxial/High Power
Wafer Fixing Method	vacuum
Adsorption range	0, 48, 96, 192 mm/ Porous adsorption (for thin films)
Wiring Method	BNC/Triaxial Kelvin Wiring
flatness	≤10um@25℃ (after compensation)

Leakage

	Coaxial Chucks Triaxial Chucks High Power Chucks (3KV)
ordinary temperatures	≤50PA ≤50FA ≤2nA@coaxial@3KV ≤10PA@Triple Coaxial@3KV
-60℃/-50℃/-40℃	≤100PA ≤ 100FA ≤2nA@coaxial@3KV ≤10PA@Triple Coaxial@3KV
200°C	≤100PA ≤ 100FA ≤2nA@coaxial@3KV ≤10PA@Triple Coaxial@3KV
300°C	≤100PA ≤ 100FA ≤ 5nA@Coax @ 3KV ≤20PA@Triple Coaxial@3KV

Auxiliary chuck

Sizes	55*55mm
Quantities	2
Appliance	RF calibration/debris or small size devices
Adsorption method	vacuum
Makings	Ceramic/Steel

Temperature rise and fall time (12")

Heating time

-60℃ -25°C	≤10min
25℃-200℃	≤25min
200°C-300°C	≤25min
cooling time
25°C- -60°C	≤50min
200°C-25°C	≤20min
300-25°C	≤25min

19874522745

miles@cindbest.com

Unit A, 1st Floor, Building 2, Jiayiyuan Digital Science Park, Xinshi Community, Dalang Subdistrict, Longhua District, Shenzhen City

Business license

CP 200/300 Semi-Automatic Probe Station

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