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CP 200/300 Semi-Automatic Probe Station
Multi-magnification Optical Display System
Compatible with 12”, 8”, 6”, and 4” wafer testing and dicing tests
Internal air suspension system effectively isolates external vibrations.
Integrated control system for rapid access to instrument testing
Software automation testing, precise calibration of mechanical accuracy
X-Y axis travel speed: 70 mm/sec, repeat positioning accuracy: ≤±1 μm
Z-axis travel speed: 20 mm/sec, Z-axis positioning repeatability: ≤ ±μm
R-axis accuracy: 0.0001°, repeat positioning accuracy: ≤±1 μm
CP Series Semi-Automatic Probe Station
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Summarize●The CP300 Series Probe Stations for semi-automated testing of 300mm (12-inch) wafers are designed for R&D, device characterization/modeling, or niche production applications, and provide accurate electrical measurements over temperature ranges for ultra-low-noise, DC, RF, millimeter-wave, and terahertz applications, with automated operation for the fastest possible time to accurate data.
●The CP300 Semi-Automatic Probe Station provides laboratory automation capabilities and characterization of precision electrical measurement devices for high volume engineering and challenging applications. It is also well suited in customized solutions, production applications, and emerging markets.
●The CP300 Semi-Automatic Probe Station provides measurement accuracy and reliability in a fully modular solution for both I-V/C-V, RTN and RF measurements in a semi-automated system that can handle any combination of 200 mm and 300 mm wafers.
Features and AdvantageDesigned for applications on a variety of chips
DC-IV / DC-CV / Pulsed IV Applications Silicon Optical Devices
RF, millimeter, negative pull applications and 4-port setups
IC Design Verification, Failure Analysis over a Wide Temperature Range of -60-300°C
Subarber wafer-level reliabilityCompatible with extended upgrades
Can be used with both micropositioners and customized probe cards and is compatible at negative temperatures
Programmable microscope motion for more automation and easy to use shortest cable interface to IC tester
Minimize the distance from the platen to the chuck for millimeter wave and probing with active probes
Supports 24/7 on-chip detection 7*24Ergonomic
Easy front loading of integrated passive isolators on wafers or single DUTs
More efficient and stable film delivery for easier system and test operations
Rational space arrangement with reduced footprint
Dashboard facilitates shorter cables and higher measurement accuracy -
Chuck platform parameter specifications
Chuck X-Y axis
Travel range
≥360 x 420mm
resolution (of a photo)
0.1 µm
position accuracy
≤±2.0µm
Repeatability
≤±1.0 µm
X-Y Stage Drive
Closed-loop high-precision stepper motor
Maximum movement speed
≥70mm/s
Chuck Z axis
Travel range
≥20mm
resolution (of a photo)
0.1µm
position accuracy
≤±2.0 µm
Repeatability
≤±1.0 µm
Z Stage drive
Closed-loop high-precision stepper motor
Maximum movement speed
≥20mm/s
*Velocity is instantaneous, not average. There are acceleration and deceleration times when moving.
Chuck Swivel
Travel range
≥15°
Resolution
0.0001°
position accuracy
≤±2.0µm (measured at the edge of a 300 mm chuck)
Repeatability
≤±1.0µm
Theta-class driver
Closed-loop high-precision stepper motor
ChucksSizes
≥300mm (200mm chuck optional)
Temp.
-60-300°C (-60-300°C, room temperature, room temperature -200/300°C optional)
Type
Coaxial/Triaxial/High Power
Wafer Fixing Method
vacuum
Adsorption range
0, 48, 96, 192 mm/ Porous adsorption (for thin films)
Wiring Method
BNC/Triaxial Kelvin Wiring
flatness
≤10um@25℃ (after compensation)
Performances
Coaxial Chucks Triaxial Chucks
High Power Chuck (3KV)
Breakdown voltage
Shield - Signal / ≥500V
≥3KV
Shield-Guard / ≥500V
≥3KV
Signal-Guard ≥500V ≥500V
≥3KV
numerical value of electrical impedance
Shield-Signal / ≥5TΩ
/
Shield-Guard / ≥1TΩ
/
Signal-Guard ≥1TΩ ≥1TΩ
/
Leakage
Coaxial Chucks Triaxial Chucks High Power Chucks (3KV)
ordinary temperatures
≤50PA ≤50FA ≤2nA@coaxial@3KV
≤10PA@Triple Coaxial@3KV
-60℃/-50℃/-40℃
≤100PA ≤ 100FA ≤2nA@coaxial@3KV
≤10PA@Triple Coaxial@3KV
200°C
≤100PA ≤ 100FA ≤2nA@coaxial@3KV
≤10PA@Triple Coaxial@3KV
300°C
≤100PA ≤ 100FA ≤ 5nA@Coax @ 3KV
≤20PA@Triple Coaxial@3KV
Auxiliary chuck
Sizes
55*55mm
Quantities
2
Appliance
RF calibration/debris or small size devices
Adsorption method
vacuum
Makings
Ceramic/Steel/Teflon
Temperature rise and fall time (12")Warming time
-60℃ -25°C
≤10min
25℃-200℃
≤25min
200°C-300°C
≤25min
cooling time
25°C- -60°C
≤50min
200°C-25°C
≤20min
300-25°C
≤25min