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SOLUTION
RF Testing
1. Probe station RF testing enables precise RF signal transmission, distortion-free measurements, and system-level error calibration at the wafer level. By integrating advanced precision mechanics, high-frequency signal pathways, and intelligent calibration technologies, this approach addresses critical challenges at high frequencies, such as skin effect, impedance mismatch, and parasitic interference. Ultimately, it allows for the accurate acquisition of key RF characteristics of the device under test (DUT), including S-parameters, power, and phase.
(1 ) Sub-micron Precision Positioning and Stable Contact System
- High-precision mechanical platform: Equipped with a piezoceramic-driven air-bearing stage, paired with low-expansion material supports such as Invar alloy, this system achieves positioning accuracy of ≤0.5 μm on the X/Y/Z axes and boasts a closed-loop control resolution of 0.1 nm. Additionally, an advanced 6-degree-of-freedom active vibration-damping system effectively mitigates vibrational disturbances, ensuring precise alignment between the high-frequency probe and the chip pads.
- High-frequency probe design tailored to specific test bands: Dedicated probes are selected based on the frequency range, such as air-coupled probes for millimeter-wave applications (up to 110 GHz) and waveguide probes for terahertz scenarios (up to 300 GHz). The probe tips feature a tungsten-rhenium alloy with gold plating, achieving contact resistances as low as 5 mΩ. Additionally, a G-S-G (ground-signal-ground) coplanar waveguide structure ensures 50-Ω characteristic impedance matching.
(2) Full-band, Low-Loss Signal Transmission Link
- Link optimization design: The transmission path from the probe to the test instrument utilizes low-loss coaxial cables or waveguide structures, minimizing high-frequency signal attenuation—for instance, insertion loss in the 40 GHz band can be kept below 0.2 dB.
- Parasitic parameter suppression: By precisely controlling the parasitic capacitance at the probe-pad interface through advanced manufacturing techniques (≤0.1 pF), and by employing a shielded probe holder along with a floating ground design, electromagnetic interference affecting weak signals is minimized.
2. The probe station RF testing solution serves as the core support for the R&D and mass production of high-frequency products such as 5G/6G chips and millimeter-wave devices. By integrating technologies like "precision mechanics + high-frequency links + accurate calibration," it builds comprehensive RF characterization capabilities ranging from wafer-level to system-level applications.
(1) Breaking the Core Bottleneck in High-Frequency Testing: Specifically addresses issues such as skin effect, impedance mismatch, and parasitic interference in high-frequency signal transmission. By leveraging sub-micron positioning, low-loss interconnects, and dynamic calibration, the system achieves precise measurements across the entire frequency range—from DC up to 300 GHz—meeting the RF parameter characterization needs of advanced-process chips.
(2) Dual empowerment for R&D and mass production: On the R&D side, it enables rapid validation of the correlation between device RF performance and process parameters, providing quantitative data for design optimization. In mass production, parallel testing combined with automated processes boosts test efficiency, while early defect screening helps reduce packaging costs. As a result, the improved yield can shorten the investment payback period to as little as 3 years.
(3) Forward-looking adaptation to technological advancements: With the development of technologies such as Chiplets and terahertz, the solution has expanded to include multi-port mixed-signal testing (optoelectronic co-design) and vertical interconnect testing (TSV probing). Through modular design and algorithmic upgrades, it continues to meet the growing demands for testing RF devices operating at higher frequency bands and featuring increasingly complex architectures.
4. Solution Summary
The probe station RF testing solution is a critical technological enabler for high-frequency applications such as 5G/6G and radar systems. At its core, it achieves a balance between testing accuracy, efficiency, and reliability through the synergistic integration of "innovative material processes, precision mechanical control, and automated system integration." This approach results in three key features:
- **Technical Adaptability**: We offer customized probe solutions tailored to meet diverse frequency-band requirements—ranging from 6GHz Pogo Pin probes to 300GHz waveguide probes, covering applications across the board, from consumer electronics to military radar systems. Additionally, we’ve overcome critical testing challenges for terahertz and silicon photonics chips through innovations like TRL calibration and de-embedding algorithms.
- Dual Support for Mass Production and Research: On the research side, we can analyze RF1/f noise characteristics across a temperature range of -60°C to 300°C—and even in vacuum environments. Meanwhile, at the mass-production level, our multi-station parallel processing and dual-sided probe architecture reduce labor costs by 60%, boost yield by 18%, and deliver a return on investment (ROI) for equipment within just three years.
- Future evolution direction: Moving toward "higher frequency, smarter, and more integrated solutions," such as developing TiN-coated arc-resistant probes tailored for 6G terahertz testing, incorporating AI to identify anomalies in S-parameters, and integrating optoelectronic collaborative detection to meet the demands of heterogeneous integrated devices.