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SOLUTION
Optoelectronic Testing
1. At the core of the probe station's optoelectronic testing solution are precise positioning and stable contact, along with the efficient integration of optical, electrical, and control systems, enabling accurate, automated characterization of optoelectronic device performance.
By utilizing a high-precision probe station, we ensure stable electrical contact between the probe and the device's electrodes, while simultaneously maintaining precise alignment of optical pathways (such as fibers and lenses). Integrated with external devices like light sources, spectrometers, and oscilloscopes, the system enables synchronized acquisition of both optical and electrical signals, ultimately delivering key performance metrics such as the device's photoelectric conversion efficiency and response speed.
(1) LED/Laser Diode (LD) Testing
The core configuration revolves around the "interplay between light output and electrical drive," requiring a high-precision probe station, pulsed/DC power supply, spectrometer, integrating sphere, and optical power meter. Key tests include measuring photoelectric conversion efficiency, spectral distribution, threshold current, and the light-power-current-voltage (LIV) characteristics. Precise temperature control is essential to simulate real-world operating conditions.
(2) Photodetector (PD) Testing
The core lies in the "simultaneous acquisition of optical signal excitation and electrical response," with equipment including a probe station, tunable wavelength light source (such as lasers or monochromators), low-noise current amplifiers, and an oscilloscope. The focus is on testing responsivity, quantum efficiency, dark current, response speed, and the spectral response range—while ensuring that ambient light and electromagnetic interference are effectively shielded.
(3). Photovoltaic (PV) Device/Solar Cell Testing
The core focus is "Simulating Solar Light Irradiation and Electrical Performance Characterization," requiring a probe station, a standard solar simulator (AM1.5G spectrum), and a source measure unit (SMU). Key tests include open-circuit voltage, short-circuit current, fill factor, and conversion efficiency. In certain scenarios, a probe array will be used to map the local performance of large-area devices.
Optoelectronic devices are functional components fabricated based on the photoelectric conversion effect. These optical devices can be categorized into optoelectronic chips, optical components, and optical modules. The main types of optoelectronic devices include: phototubes, photomultiplier tubes, photoresistors, photodiodes, phototransistors, solar cells, optocouplers, LEDs (light-emitting diodes), LDs (laser diodes), and photodetectors, among others.
These devices are widely used in fields such as lasers, optical detection, optical transmission, optical processing, light-based displays, optical storage, optical integration, optoelectronic communication, healthcare, measurement, information processing, and optical sensing. To ensure the performance and quality of optoelectronic devices, it is essential to conduct thorough testing—covering their various physical, electrical, optical, thermal, and other characteristics—using a range of experimental techniques to verify their reliability and excellence.
2. Core pain points addressed and key technical highlights:
(1) Poor optoelectronic synchronization: In traditional testing, the loading of optical signals occurs asynchronously with the acquisition of electrical signals, making it impossible to accurately capture critical parameters such as device response speed and transient characteristics.
(2) Insufficient testing accuracy: Unstable contact between the probe and electrode, misalignment of the optical path, combined with ambient light and electromagnetic interference, lead to poor data repeatability and significant measurement errors.
(3) Inefficient testing process: Manually replacing components, adjusting optical paths, and positioning probes is particularly cumbersome and time-consuming when dealing with wafer-level mass testing, making it difficult to meet the demands of high-volume production.
(4) Poor scene adaptability: Different optoelectronic devices (such as LEDs and PDs) have significantly varying requirements for external components like light sources and detectors, making it difficult for traditional solutions to quickly switch between and integrate these components.
3. Key Technical Points
(1) High-Precision Coordinated Alignment Technology: Utilizing optical microscopes, laser interferometers, and other tools to achieve dual-level precision alignment—first between the probe and electrodes (at the μm scale), and then between the optical path and the light-sensitive/emitting areas of the device—ensuring efficient coupling of optical and electrical signals.
(2) Opto-Electro-Control Integrated Coordination Technology: This technology employs a unified control system to achieve millisecond-level synchronous triggering of light source switching/adjustment, probe stage movement, power output, and signal acquisition, ensuring the accuracy of transient/dynamic characteristic testing.
(3) Low-Noise and Anti-Interference Design: The probe station features a shielded chamber, paired with low-noise power supplies, current amplifiers, and other peripherals. Additionally, an optical shielding structure is employed to eliminate ambient light interference, further reducing noise in the test substrate.
(4) Modular and Automated Integration Technology: Utilizing a modular design, this system allows for the quick replacement of peripherals such as light sources and detectors to accommodate various devices. Combined with features like wafer adsorption and automatic probe card calibration, it enables fully automated testing—from individual dies to entire wafers.
4. Summary of the Probe Station Optoelectronic Testing Solution.
(1) Breakthrough in Ultra-High-Resolution Imaging: Shifting from traditional millimeter-level precision to sub-micron or even nanometer-scale resolution, advanced techniques such as confocal microscopy and near-field optical microscopy now enable clear visualization of minute light details in micro-LEDs, quantum dots, and other nano-scale devices.
(2) Breakthrough in simultaneous opto-electro-optical characterization: Achieving millisecond-level synchronous acquisition of optical signals from the light spot (intensity, spectrum), electrical signals (voltage, current), and high-resolution micro-morphology images, thereby resolving the critical challenge of correlating "where the light spot is, how it performs, and why it behaves this way."
(3) Dynamic Transient Capture Breakthrough: Breaking free from the limitations of traditional static testing, this innovative approach leverages high-speed cameras paired with pulsed light sources to capture nanosecond-level transient changes in light—such as the switching response of laser diodes or the pulse response dynamics of photodetectors.
(4) Large-area rapid scanning breakthrough: By integrating an automated platform with line-array detection technology, we’ve increased the efficiency of single-point testing by a factor of 100, enabling fast light-spot mapping across entire wafers (8–12 inches) while maintaining both microscopic precision and macroscopic throughput.
Importance
(5) Enabling mass production of micro- and nano-optoelectronic devices: It serves as the "keen-eyed inspector" for high-yield detection during Micro-LED mass transfer and wafer-level screening of optoelectronic detectors—without it, large-scale quality control of these tiny devices would be impossible.
(6) Accelerating device failure analysis: This technology enables direct localization of the physical location of "defective spots" and "weak light points," reducing the failure analysis process from "whole-wafer screening" to "single-point pinpointing," thereby significantly cutting down R&D and production costs.
(7) Driving innovation in next-generation optoelectronic devices: Providing cutting-edge performance verification tools—such as single-photon detectors and integrated optoelectronic components—for emerging fields like quantum communication and photonic chips is a critical support that bridges the gap between laboratory breakthroughs and practical applications.