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SOLUTION
Laser Repair
1. The laser repair probe station is a precision testing instrument integrated with laser repair functionality, primarily used for defect repair and electrical performance testing in industries such as semiconductors and panel displays.
Real-time Monitoring and Feedback: Equipped with real-time monitoring systems, such as high-speed cameras or online microscopes, the system continuously observes the repair process during laser restoration. It automatically adjusts laser power, pulse frequency, and other parameters based on pre-set criteria, ensuring consistent and stable repair quality.
2. Core pain points addressed and key technical highlights:
(1) Low repair precision: Photon waveguides typically have widths in the sub-micron range, making it challenging for conventional repair techniques to achieve high-precision repairs. However, laser-based repair probe systems leverage the ultrashort pulse duration, ultra-high peak power, and sub-micron-level machining accuracy of lasers, enabling precise focusing down to micrometer or even nanometer scales—and thus delivering highly accurate repair outcomes.
(2) Significant Environmental Interference: During low-temperature testing, water molecules in the atmosphere form a conductive water film on the wafer surface. Meanwhile, at high temperatures, oxygen molecules can trigger material oxidation, causing traditional test yields to plummet by as much as 40%. The laser repair probe station mitigates these environmental interferences during the repair process by incorporating features such as an integrated vacuum environment or specialized gas protection systems.
(3) Poor versatility of probe boards: Traditional probe boards typically use soldering to secure the probes, meaning each probe board is designed for only one specific type of substrate circuit and cannot be easily adjusted. Moreover, soldering demands high precision and reliability, making the process time-consuming and labor-intensive. In contrast, laser-repairable probe stations feature a detachable probe-mounting system, allowing flexible installation and adjustment of probes tailored to various substrate types. This approach significantly enhances the probe board’s versatility, accuracy, and operational efficiency.
(4) Low Repair Efficiency: Traditional repair methods often require manual execution of multiple steps—ranging from defect detection and repair to re-inspection—making the process cumbersome and inefficient. In contrast, the laser repair probe station features fully automated functionality spanning the entire workflow, from defect detection and laser repair all the way through post-repair inspection, significantly boosting repair efficiency.
The key technical aspects of the laser repair probe station include:
(1) High-precision laser system: Typically equipped with pulsed Nd:YAG lasers, offering a variety of wavelengths such as 1064 nm, 532 nm, and 355 nm, enabling precise processing tailored to different materials. The laser pulse width is extremely short—around 3–4 ns—and the pulse energy can be adjusted according to the selected wavelength, allowing for minimum feature sizes as small as 1 μm.
(2) Precision Positioning and Motion Control: Utilizing a nanometer-level multi-axis motion stage, this system achieves sub-micron positioning accuracy while delivering millisecond-level response speed. It can dynamically adjust the laser path in real time based on optical feedback, ensuring precise targeting of the repair area.
(3) Automation and Intelligent Control: Equipped with full-process automation capabilities, this system can automatically identify defective devices on wafers, perform selective repairs, and provide real-time evaluation of the repair outcomes. Some models even feature advanced learning algorithms that continuously optimize the repair process, ultimately boosting the overall yield of successful repairs.
(4) Multi-functional Integration: In addition to laser repair, this system also integrates functions such as electrical performance testing. It allows for electrical performance checks of the device both before and after repair, providing immediate feedback on the effectiveness of the restoration process. Furthermore, the system can be equipped with observation tools like microscopes, enabling real-time monitoring of the repair procedure and the device’s current status.
4. Summary of the probe station laser repair solution.
The probe station laser repair solution is a core technology for ensuring yield in precision manufacturing fields such as semiconductors, display panels, and photonic chips. By integrating the entire process—from detection and localization to repair and verification—it enables precise restoration of defects at the micrometer level.
- Yield and Cost Optimization: We’ve increased the traditional repair yield from 60% to over 90%, with some applications even reaching 99.99%. At the same time, domestically produced equipment costs only 30% of imported alternatives, significantly reducing losses in precision manufacturing.
- Non-destructive processing with enhanced versatility: Utilizing non-contact laser machining, the heat-affected zone is kept to within 1 μm, preventing probe contact from damaging micrometer-scale chips. Additionally, software integration supports multiple laser model protocols, enabling compatibility with substrates of varying sizes and accommodating different defect types.
- Versatile multi-domain capability: Covers applications such as highlight and dark spot repair for LCD/OLED panels, photonic chip waveguide correction, and pinhole filling on reticles—supporting the repair of microchips as small as ≤50μm and accommodating full-size panel repairs ranging from 15.6 to 120 inches.