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Fully Automatic Probe Station
Shenzhen Sendongbao Technology Co., Ltd. introduces its fully automatic wafer probe station series, designed to accommodate 4- to 12-inch wafer testing. The equipment supports various test environment configurations, including high/low temperatures, high voltages, and low-leakage setups. Featuring user-friendly operation and exceptional performance stability, these systems boast high precision, remarkable efficiency, minimal vibration, and reduced noise levels.
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Fully Automatic Probe Station
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Features and Benefits
Designed specifically for applications on various chips
- Accuracy can reach up to ±1 micron, thanks to a fully closed-loop motion control system that delivers high precision, exceptional efficiency, and robust positioning performance.
- IndexTime can be as low as 240 milliseconds, featuring a marble base and a highly rigid structure to deliver high load capacity, minimal vibration, and rapid settling motion.
- Maximum lifting force of 750 kgf, with integrated four-corner support on the Z-axis, ensuring minimal deformation even under high loads or off-center loading conditions.
- Testing temperature range: -40 to 200°C. We have independently developed various CHUCKs to address critical process challenges and achieve precise temperature control.
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C300 H300 T300 M300 Applicable Occasions Standard Model Standard Model Suitable for three temperatures Suitable for storage Applicable Wafer Size 12-inch / 8-inch Applicable Wafer Thickness 200–2,200 μm 200–2,200 μm 200–2,200 μm 200–2,200 μm Overall Accuracy XY Axis: ±1 μm
ZF axis: ±2 μmXY Axis: ±1 μm
ZF axis: ±2 μmXY Axis: ±1 μm
ZF axis: ±2 μmXY Axis: ±1 μm
ZF axis: ±2 μmIndex time 240ms 240ms 240ms 240ms (X/Y: 10mm, (X/Y: 10mm, (X/Y: 10mm, (X/Y: 10mm, Z: 0.5 mm) Z: 0.5 mm) Z: 0.5 mm) Z: 0.5 mm) Needle-based pressure measurement 250kgf 250kgf 250kgf 250kgf Test temperature Room temperature Room temperature ~ 150°C -55 to 200°C Room temperature ~ 150°C Test machine connection method Cable, Hard Docking Cable, Hard Cable, Hard Hinge,
Auto-levelingDirect Docking Docking, Direct
DockingDocking, Direct
DockingCommunication interface GPIB, RS232 GPIB, RS232 GPIB, RS232 GPIB, RS232 Equipment dimensions 1680mm (W) × 1890mm, 1680mm (W) × 1890mm, 1680mm (W) × 2080mm, 2000mm (W) × 1890mm m(D) * 1490 mm (H) mm(D) * 14 m(D) * 1490 mm (H) mm(D) * 14 90mm (H) 90mm (H) Equipment weight 2000kg 2000kg 2000kg 2200kg Power requirements 220VAC 1.0 kVA 220VAC2.0KVA 220VAC5.7KVA 220VAC2.0KVA Compressed air pressure ≥0.6 MPa ≥0.6 MPa ≥0.6 MPa ≥0.6 MPa Vacuum pressure ≤ -60 kPa ≤ -60 kPa ≤ -60 kPa ≤ -60 kPa ※ Supports Bernoulli fingers, meeting the requirements for thin sheets ※ Temperature customization supported — -60°C ※ Supports Automatic Card Replacement (APC) ※ Supports optional installation of FFUs to meet high-cleanliness requirements C200 H200 T200 T200HV Applicable Occasions Standard Model Standard Model Suitable for three temperatures Suitable for Generation 3.5 Applicable Wafer Size 8-inch / 6-inch / 5-inch / 4-inch Applicable Wafer Thickness 200–2,200 μm 200–2,200 μm 200–2,200 μm 200–2,200 μm Overall Accuracy XY Axis: ±1 μm
ZF axis: ±2 μmXY Axis: ±1 μm
ZF axis: ±2 μmXY Axis: ±1 μm
ZF axis: ±2 μmXY Axis: ±1 μm
ZF axis: ±2 μmIndex time 250ms (X/Y: 10mm,
Z: 0.5 mm)250ms (X/Y: 10mm, Z
Z: 0.5 mm)50ms (X/Y: 10mm, Z
0.5mm)50ms (XY: 10mm,
Z: 0.5 mm)Needle-based pressure measurement 150kgf 150kgf 150kgf 150kgf Test temperature Room temperature Room temperature ~ 150°C -55 to 200°C -40 to 150°C Test machine connection method Cable, Hard Docking Cable, Hard Docking Cable, Hard Docking Cable, Hard Docking Communication interface GPIB, RS232 GPIB, RS232 GPIB, RS232 GPIB, RS232 Equipment dimensions 1300mm (W) × 1542 mm, 1300mm (W) × 1542 mm, 1300mm (W) × 1740 mm, 1300mm (W) × 1740 mm m(D) × 960 mm (H) mm(D) × 960mm(H) m(D) × 960 mm (H) mm(D) × 960mm(H) Equipment weight 1200kg 1200kg 1200kg 1200kg Power requirements 220VAC 1.0 kVA 220VAC2.0KVA 220VAC 5.7 kVA 220VAC5.7KVA Compressed air pressure ≥0.6 MPa ≥0.6 MPa ≥0.6 MPa ≥0.6 MPa Vacuum pressure ≤ -60 kPa ≤ -60 kPa ≤ -60 kPa ≤ -60 kPa ※ Supports Bernoulli fingers, meeting the requirements for thin sheets ※ Temperature customization supported — Down to -60°C ※ Supports Automatic Profile Change (APC) ※ Supports FFU retrofitting, fully loaded High-foot cleanliness requirements
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