-
Products
-
-
-
-
-
Contact Us
Custom Temperature Chucks
Accessories
- Description
- Parameters
- Download
- Video
-
The probe station's high- and low-temperature heating chuck is a critical component in semiconductor testing, enabling precise control of sample temperature and allowing electrical performance tests to be conducted on wafers or chips under various thermal conditions.
Feature Highlights:
- Wide temperature range: Cindbest’s standard gold/nickel-plated thermal chucks operate from -10°C to 600°C, while custom semi-automatic chucks are available in a temperature range of -60°C to 300°C.
- High-precision temperature control: Available with temperature resolutions ranging from 0.1°C, 0.01°C, to even 0.001°C, and offering temperature stability as precise as ±1°C or ±0.1°C.
- Rapid temperature control: The chuck features advanced cooling and heating technology, enabling much faster temperature transitions compared to conventional systems.
- Vacuum Adsorption: The wafer is securely held in place during testing by being drawn onto the surface via vacuum channels. Some chucks even feature independent vacuum channels, allowing them to accommodate wafers of various sizes.
- Structural Design:
- Smooth Surface: The chuck features high surface flatness—under normal conditions, the surface flatness can reach up to 10 µm—ensuring excellent contact between the wafer and the chuck, thereby guaranteeing uniform temperature distribution and test accuracy.
- Chucks are typically designed to be thin, making it easier to integrate them with probes while also facilitating heat transfer.
- Diverse interfaces: The chuck surface typically features gold or nickel plating to minimize contact resistance, incorporates an electrical floating function, and includes a grounding point. Some models even offer a three-axis option for low-leakage/noise measurements.
- Cooling and Heating Methods:
- Air-cooled: Utilizes air cooling, eliminating the need for liquids or Peltier elements. It offers high safety while also providing the advantages of a compact footprint and space-saving coolant design.
- Liquid nitrogen cooling: Utilizing liquid nitrogen, this system can achieve extremely low temperatures, such as -196°C, with automatic temperature control.
- Application areas: Primarily used for temperature-dependent electrical performance analysis of semiconductor devices and wafers, including power device modeling tests, wafer reliability assessments, production-level temperature cycling inspections, temperature-dependent optoelectronic testing, and RF temperature cycling tests, among others. -
（1）8-inch ambient temperature annular coaxial chuck
Cindbest TCNRC200
● Chuck diameter 200mm, flatness ± 10um (after compensation)
Noted:The flatness of the chuck during overall motion compensated by the semi-automatic probe station testing software.
● Material: Nickel plated or gold-plated aluminum alloy, stainless steel
● Sample size for adsorption: Conventional crystal grain size of 50150200mm, minimum 10X10mm for calibration plates, flakes, and fragments (auxiliary chuck)
● Vacuum ring: 15,40,70105140165190mm Adsorption area control: software control (50,150,200mm)(2) 8-inch room temperature annular Tri-axis chuck
Cindbest TCNRT200
● Chuck diameter 200mm, flatness ± 10um (after compensation)
● Material: Nickel or gold plated aluminum alloy, stainless steelNoted:Regarding the material of the chuck: For high-power applications,
choose gold plating, while for back electrode applications, choose gold plating or nickel plating. Ordinary materials are usually stainless steel
● The chuck is a three-axis structure with a Top plate layer, Guard layer, and Ground shielding layer
● Adsorption sample size: conventional crystal grain size 50,150,200mm, minimum fragment size 10X10mm (auxiliary chuck)
● Vacuum ring: 15,40,70,105,140,165,190mm
● Adsorption area control: software control (50,150,200mm)
● Leakage current: 200fA/V @ 25 ℃ (test conditions: dry environment with grounding shield)(3) 8-inch room temperature porous coaxial chuck
Cindbest TCNPC200●Chuck diameter 200mm
●Material: Nickel or gold plated aluminum alloy, stainless steel
●Adsorption sample size: Conventional wafer size 50,150,200mm, minimum fragment size 10X10mm (auxiliary chuck)
●Porous adsorption, vacuum pore: 0.5mm
●Adsorption area control: software control (50150200mm)(4) 8-inch room temperature porous three-axis chuck
Cindbest TCNPT200●Chuck diameter 200mm
●The chuck is a three-axis structure with a Top plate layer, Guard layer, and Ground shielding layer
●Material: Nickel or gold plated aluminum alloy, stainless steel
●Adsorption sample size: conventional crystal grain size 50150200mm, minimum fragment size 10X10mm (auxiliary chuck)
●Porous adsorption, vacuum pore: 0.5mm
●Adsorption area control: software control (50.150.200mm)
●Leakage current: 200fA/V @ 25 '(test conditions: dry environment with grounding shield)
●Suitable for thin sheets with a thickness less than 200um(5) 8-inch high-temperature annular Tri-axis chuck
Cindbest TCFRT200●Chuck diameter 200mm
●Vacuum adsorption method: central adsorption hole+peripheral multi ring adsorption groove,partition independent control chuck for three-axis structure, with top plate layer, guard layer and ground shielding layer.
●Chuck temperature control range:
room temperature to 200'C, chuck temperature uniformity is<± 1 ° C,
temperature stability is+0.1 ° C, control accuracy is 0.1 ° C, display accuracy is 0.1 ° C
Leakage current: Tri-axis 200fAV @ 25 ° C (test conditions: dry environment of ground shielding)
● Chuck temperature rise and fall rate is as follows:+25 ° C to+200 ° C: ≤ 30 min-200 ° C to+25 ° C: ≤ 30 min